Solid PCD Micro-Edge Milling Cutters Empower Precision Machining of SiC Wafer Trays
As a professional manufacturer focusing on ultra-hard cutting tools, LNKUT specializes in the R&D and production of high-performance PCD and PCBN cutting tools, delivering tailored and reliable tool solutions for the global semiconductor precision manufacturing industry. Targeting the core processing pain points of third-generation semiconductor materials, our solid PCD micro-edge milling cutters stand out as the ideal choice for the high-efficiency machining of silicon carbide (SiC) wafer trays.
This application targets semiconductor-grade silicon carbide workpieces with specifications of D380×5mm. As a hard and brittle material with high hardness and proneness to chipping, it places strict demands on machining accuracy and tool performance. LNKUT solid PCD micro-edge milling cutters are engineered with premium polycrystalline diamond blanks, boasting exceptional wear resistance and sharp, precision-ground micro-edges, which perfectly match UEM-500 machine tools for ultrasonic-assisted machining.
When paired with advanced ultrasonic machining technology, our cutters significantly reduce cutting forces, effectively eliminate workpiece chipping and deformation, and greatly improve surface quality and machining consistency. Verified by actual production data: the total machining time is shortened from 840 minutes to 480 minutes, representing a 45% increase in efficiency; tool life is doubled from 150 minutes to 300 minutes, fully optimizing production efficiency and reducing tool consumption and downtime costs for semiconductor manufacturers.
LNKUT remains committed to technological innovation and customer-centric solutions, providing customized non-standard tool design and professional application support for the precision machining of hard and brittle materials. Our solid PCD micro-edge milling cutters are widely applicable to semiconductor, optoelectronic and other high-end manufacturing fields, helping enterprises break through processing bottlenecks and achieve high-quality, high-efficiency mass production.
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